Program MIW2023

Sunday, May 7, 2023
From 18:00Welcome Reception at L'interlope, Rue de l’Evole 39/A, Neuchâtel
Monday, May 8, 2023
09:00 - 09:45Opening (MIW2023 organizers) and introductory talk
Christophe BallifCSEM/EPFLIntroductory talk
09:45 - 11:10Session I: Screen-printed metallisation : state-of-the-art and beyond
Session chair 1: Jan Lossen (ISC Konstanz)
Session chair 2: Marco Galiazzo (Applied Materials)
Padhamnath Pradeep SERISScreen-printed metallization for industrial solar cells - current perspectives and future opportunities (invited talk)
Glatthar RaphaelUniv. KonstanzFundamental microscopic studies on the etching behavior of silver pastes on poly-Si/SiOx passivating contacts
Tokiko MisakiAsada MeshDeformation Behavior of Screen Mesh in Screen Printing and Its Effect on Printing Results
11:10 - 11:30Coffee break
11:30 - 12:45Session II: Multi-busbars/wire soldering
Session chair 1: Eszter Voroshazi (CEA)
Session chair 2: Florian Clement (ISE)
Dominik RudolphISC KonstanzImprovement of solder interconnections applied on back contact solar cells with low-temperature copper paste busbars
Jonas MartenKITHighly conductive coated wire for interconnetion of solar cells with TECC-Wire technology
Rik van Dyck
imomecInvestigation of Multi-Wire Interconnected Lightweight PV modules Using Micro-Computed Tomography
12:45 - 14:00Lunch break
14:00 - 15:00Poster session
Florent PernoudCEARecent developments of HJT screen printing process at CEA-INES
Mathis Van de VoordeUniv. TweenteHigh Aspect Ratio Triangular Front Contacts for Solar Cells Fabricated by String-printing
Alejandro Borja BlockEPFLChallenges of black metallic interconnects for integrated PV module application
Daniel OurinsonFhISEPaste-based Silver Reduction for iTOPCon Solar Cells
Inaki CornagoCENERTiSi2 and LIFT as potential alternatives to silver and screen printing for solar cells electric contacts
15:00 - 16:30Session III: Ag reduction in low temperature pastes
Session chair 1: Remi Monna (CEA)
Session chair 2: Andreas Waltinger (Meyer Burger)
Alexis BarrouCSEMLife Cycle Assessment of Minerals and Metals for PV: Case Study with the Silicon Heterojunction Technology
Sebastian PingelFhISEProgress on the reduction of silver consumption in metallization of SHJ solar cells
Mariana BertoniArizona State UniversityPerformance and Accelerated Testing of Reactive Silver Inks Metallization of Silicon Heterojunctions with 90% less Silver
Maximilian PospischilHighLine TechnologyOptimizing solar cell metallisation by parallel dispensing
16:30 - 17:45Market Place Discussions
From 18:30Aperitif & Dinner, Quai du Port 10, Neuchâtel
Tuesday, May 9, 2023
9:00 - 9:30Wrap - Up Market Place Discussions
9:30 - 10:40Session IV: Copper-based cell metallisation
Session chair 1: Jonas Bartsch (FhISE)
Session chair 2: Antonin Faes (CSEM)
Veysel UnsurNecmettin Erbakan University, ODTU-GUNAMScreen Printable Fire Through Nickel Contacts for Crystalline Silicon Solar Cells
Thad DruffelBert Thin Films, Univ. North CarolinaScreen Printable Copper Pastes for Silicon Solar Cells
Agata LachowiczCSEMStability of Mini-modules with Copper Plated Heterojunction Solar Cells
10:40 - 11:10Coffee break
11:10 - 12:45Session V: Silicon heterojunction cell metallisation and LT interconnections
Session chair 1: Jun Zhao (CSEM)
Session chair 2: Maximilian Pospischil (Highline)
Linjia ZhangSuzhou iSilver Materials Co.Research and development of low temperature paste for silicon heterojunction solar cells
Angela De RoseFhISELow-temperature metallization & interconnection for silicon heterojunction and perovskite silicon tandem solar cells
Germain ReyCEASilicon heterojunction solar cells: solder, process and equipment qualification
Remi MonnaCEAReduction of silver usage in ECA based busbar interconnection
12:45 - 13:45Lunch break
13:45 - 15:15Session VI: ECA based interconnections technologies
Session chair 1: Guy Beaucarne (DOW)
Session chair 2: Giuseppe Galbiati (Henkel)
Vincent BarthCEAMethodology of ECA material characterization and qualification
Maria Ignacia Devoto AcevedoISC KonstanzValidation of methodology to determine the contact resistivity of ECA-based bonds grounded on end-contact resistance measurements using redundant and modified TLM test structures
Julian WeberFhISEElectrically conductive adhesive-free interconnection of shingle solar cells
Veronika NikitinaFhISEShingling meets perovskite-silicon heterojunction tandem solar cells
15:15 - 15:30Closing and Goodbye
15:30 - 17:00Networking and tour of CSEM/EPFL