| Sunday, May 7, 2023 | |||
| From 18:00 | Welcome Reception at L'interlope, Rue de l’Evole 39/A, Neuchâtel | ||
| Monday, May 8, 2023 | |||
| 09:00 - 09:45 | Opening (MIW2023 organizers) and introductory talk | ||
| Christophe Ballif | CSEM/EPFL | Introductory talk | |
| 09:45 - 11:10 | Session I: Screen-printed metallisation : state-of-the-art and beyond | ||
| Session chair 1: Jan Lossen (ISC Konstanz) Session chair 2: Marco Galiazzo (Applied Materials) |
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| Padhamnath Pradeep | SERIS | Screen-printed metallization for industrial solar cells - current perspectives and future opportunities (invited talk) | |
| Glatthar Raphael | Univ. Konstanz | Fundamental microscopic studies on the etching behavior of silver pastes on poly-Si/SiOx passivating contacts | |
| Tokiko Misaki | Asada Mesh | Deformation Behavior of Screen Mesh in Screen Printing and Its Effect on Printing Results | |
| 11:10 - 11:30 | Coffee break | ||
| 11:30 - 12:45 | Session II: Multi-busbars/wire soldering | ||
| Session chair 1: Eszter Voroshazi (CEA) Session chair 2: Florian Clement (ISE) |
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| Dominik Rudolph | ISC Konstanz | Improvement of solder interconnections applied on back contact solar cells with low-temperature copper paste busbars | |
| Jonas Marten | KIT | Highly conductive coated wire for interconnetion of solar cells with TECC-Wire technology | |
| Rik van Dyck | imomec | Investigation of Multi-Wire Interconnected Lightweight PV modules Using Micro-Computed Tomography | |
| 12:45 - 14:00 | Lunch break | ||
| 14:00 - 15:00 | Poster session | ||
| Florent Pernoud | CEA | Recent developments of HJT screen printing process at CEA-INES | |
| Mathis Van de Voorde | Univ. Tweente | High Aspect Ratio Triangular Front Contacts for Solar Cells Fabricated by String-printing | |
| Alejandro Borja Block | EPFL | Challenges of black metallic interconnects for integrated PV module application | |
| Daniel Ourinson | FhISE | Paste-based Silver Reduction for iTOPCon Solar Cells | |
| Inaki Cornago | CENER | TiSi2 and LIFT as potential alternatives to silver and screen printing for solar cells electric contacts | |
| 15:00 - 16:30 | Session III: Ag reduction in low temperature pastes | ||
| Session chair 1: Remi Monna (CEA) Session chair 2: Andreas Waltinger (Meyer Burger) |
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| Alexis Barrou | CSEM | Life Cycle Assessment of Minerals and Metals for PV: Case Study with the Silicon Heterojunction Technology | |
| Sebastian Pingel | FhISE | Progress on the reduction of silver consumption in metallization of SHJ solar cells | |
| Mariana Bertoni | Arizona State University | Performance and Accelerated Testing of Reactive Silver Inks Metallization of Silicon Heterojunctions with 90% less Silver | |
| Maximilian Pospischil | HighLine Technology | Optimizing solar cell metallisation by parallel dispensing | |
| 16:30 - 17:45 | Market Place Discussions | ||
| From 18:30 | Aperitif & Dinner, Quai du Port 10, Neuchâtel | ||
| Tuesday, May 9, 2023 | |||
| 9:00 - 9:30 | Wrap - Up Market Place Discussions | ||
| 9:30 - 10:40 | Session IV: Copper-based cell metallisation | ||
| Session chair 1: Jonas Bartsch (FhISE) Session chair 2: Antonin Faes (CSEM) |
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| Veysel Unsur | Necmettin Erbakan University, ODTU-GUNAM | Screen Printable Fire Through Nickel Contacts for Crystalline Silicon Solar Cells | |
| Thad Druffel | Bert Thin Films, Univ. North Carolina | Screen Printable Copper Pastes for Silicon Solar Cells | |
| Agata Lachowicz | CSEM | Stability of Mini-modules with Copper Plated Heterojunction Solar Cells | |
| 10:40 - 11:10 | Coffee break | ||
| 11:10 - 12:45 | Session V: Silicon heterojunction cell metallisation and LT interconnections | ||
| Session chair 1: Jun Zhao (CSEM) Session chair 2: Maximilian Pospischil (Highline) |
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| Linjia Zhang | Suzhou iSilver Materials Co. | Research and development of low temperature paste for silicon heterojunction solar cells | |
| Angela De Rose | FhISE | Low-temperature metallization & interconnection for silicon heterojunction and perovskite silicon tandem solar cells | |
| Germain Rey | CEA | Silicon heterojunction solar cells: solder, process and equipment qualification | |
| Remi Monna | CEA | Reduction of silver usage in ECA based busbar interconnection | |
| 12:45 - 13:45 | Lunch break | ||
| 13:45 - 15:15 | Session VI: ECA based interconnections technologies | ||
| Session chair 1: Guy Beaucarne (DOW) Session chair 2: Giuseppe Galbiati (Henkel) |
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| Vincent Barth | CEA | Methodology of ECA material characterization and qualification | |
| Maria Ignacia Devoto Acevedo | ISC Konstanz | Validation of methodology to determine the contact resistivity of ECA-based bonds grounded on end-contact resistance measurements using redundant and modified TLM test structures | |
| Julian Weber | FhISE | Electrically conductive adhesive-free interconnection of shingle solar cells | |
| Veronika Nikitina | FhISE | Shingling meets perovskite-silicon heterojunction tandem solar cells | |
| 15:15 - 15:30 | Closing and Goodbye | ||
| 15:30 - 17:00 | Networking and tour of CSEM/EPFL | ||
8. & 9. MAY 2023
