Sunday, May 7, 2023 | |
From 18:00 | | Welcome Reception at L'interlope, Rue de l’Evole 39/A, Neuchâtel |
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Monday, May 8, 2023 | |
09:00 - 09:45 | | Opening (MIW2023 organizers) and introductory talk |
| Christophe Ballif | CSEM/EPFL | Introductory talk |
09:45 - 11:10 | | Session I: Screen-printed metallisation : state-of-the-art and beyond |
| Padhamnath Pradeep | SERIS | Screen-printed metallization for industrial solar cells - current perspectives and future opportunities (invited talk) |
| Glatthar Raphael | Univ. Konstanz | Fundamental microscopic studies on the etching behavior of silver pastes on poly-Si/SiOx passivating contacts |
| Tokiko Misaki | Asada Mesh | Deformation Behavior of Screen Mesh in Screen Printing and Its Effect on Printing Results |
11:10 - 11:30 | | Coffee break |
11:30 - 12:45 | | Session II: Multi-busbars/wire soldering |
| Dominik Rudolph | ISC Konstanz | Improvement of solder interconnections applied on back contact solar cells with low-temperature copper paste busbars |
| Jonas Marten | KIT | Highly conductive coated wire for interconnetion of solar cells with TECC-Wire technology |
| Bin Luo | imomec | Investigation of Multi-Wire Interconnected Lightweight PV modules Using Micro-Computed Tomography |
12:45 - 14:00 | | Lunch break |
14:00 - 15:00 | | Poster session |
| Florent Pernoud | CEA | Recent developments of HJT screen printing process at CEA-INES |
| Mathis Van de Voorde | Univ. Tweente | High Aspect Ratio Triangular Front Contacts for Solar Cells Fabricated by String-printing |
| Alejandro Borja Block | EPFL | Challenges of black metallic interconnects for integrated PV module application |
| Daniel Ourinson | FhISE | Paste-based Silver Reduction for iTOPCon Solar Cells |
| Inaki Cornago | CENER | TiSi2 and LIFT as potential alternatives to silver and screen printing for solar cells electric contacts |
15:00 - 16:30 | | Session III: Ag reduction in low temperature pastes |
| Alexis Barrou | CSEM | Life Cycle Assessment of Minerals and Metals for PV: Case Study with the Silicon Heterojunction Technology |
| Sebastian Pingel | FhISE | Progress on the reduction of silver consumption in metallization of SHJ solar cells |
| Mariana Bertoni | Arizona State University | Performance and Accelerated Testing of Reactive Silver Inks Metallization of Silicon Heterojunctions with 90% less Silver |
| Maximilian Pospischil | HighLine Technology | Optimizing solar cell metallisation by parallel dispensing |
16:30 - 17:45 | | Market Place Discussions |
From 18:30 | | Aperitif & Dinner, Quai du Port 10, Neuchâtel |
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Tuesday, May 9, 2023 | |
9:00 - 9:30 | | Wrap - Up Market Place Discussions |
9:30 - 10:40 | | Session IV: Copper-based cell metallisation |
| Berkeli Akgayev | Necmettin Erbakan University | Screen Printable Fire Through Nickel Contacts for Crystalline Silicon Solar Cells |
| Thad Druffel | Bert Thin Films/Univ. North Carolina | Screen Printable Copper Pastes for Silicon Solar Cells |
| Agata Lachowicz | CSEM | Stability of Mini-modules with Copper Plated Heterojunction Solar Cells |
10:40 - 11:10 | | Coffee break |
11:10 - 12:45 | | Session V: Silicon heterojunction cell metallisation and LT interconnections |
| Linjia Zhang | Suzhou iSilver Materials Co. | Research and development of low temperature paste for silicon heterojunction solar cells |
| Angela de Rose | FhISE | Low-temperature metallization & interconnection for silicon heterojunction and perovskite silicon tandem solar cells |
| Germain Rey | CEA | Silicon heterojunction solar cells: solder, process and equipment qualification |
| Remi Monna | CEA | Reduction of silver usage in ECA based busbar interconnection |
12:45 - 13:45 | | Lunch break |
13:45 - 15:15 | | Session VI: ECA based interconnections technologies |
| Vincent Barth | CEA | Methodology of ECA material characterization and qualification |
| Maria Ignacia Devoto Acevedo | ISC Konstanz | Validation of methodology to determine the contact resistivity of ECA-based bonds grounded on end-contact resistance measurements using redundant and modified TLM test structures |
| Julian Weber | FhISE | Electrically conductive adhesive-free interconnection of shingle solar cells |
| Veronika Nikitina | FhISE | Shingling meets perovskite-silicon heterojunction tandem solar cells |
15:15 - 15:30 | | Closing and Goodbye |
15:30 - 17:00 | | Networking and tour of CSEM/EPFL |