| Tuesday, October 22, 2024 |
| From 18:00 | | | Welcome reception |
| Wednesday, October 23, 2024 |
| 08:00 -8:30 | | | Registration and coffee |
| 08:30 - 08:50 | | | Opening (MIW2024 organizers) |
| David Duca | CEA INES | Introductory talk |
| 08:50 - 10:00 | | | Session I: Screen-printed metallisation |
| Eve Krassowski | Cell Engineering | Are LECO induced Current Fired Contacts stable over the lifetime of a solar module? - a microstructural assessment. |
| Ning Chen | Wuxi Autowell Technology | Review of the latest industrial progress in screen printing |
| Saman Sharbaf Kalaghichi | ISC Konstanz | Progress in contacting boron doped poly Si layers for advanced passivated contact solar cells |
| 10:00 - 10:20 | | | Coffee break |
| 10:20 - 11:20 | | | Session II: Poster session A |
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| 11:20 - 12:30 | | | Session III: Plated metallization |
| Jonas Eckert | FhISE | Understanding Direct contact Plating for industry level bifacial TOPCon solar cells |
| Torsten Voss | Atotech GmbH | Formation of durable silicon/metal interface on TOPCon cells by plated metallization |
| Bertrand Paviet-Salomon | CSEM | Copper Electrodeposition on Industrial M10 Heterojunction and on TOPCon Cells |
| 12:30 - 13:30 | | | Lunch break |
| 13:30 - 14:20 | | | Session IV: Industry Session |
| Marco Galiazzo | Applied Materials | Advancements in Equipment and Process for PV metallization |
| Marco Balucani | Rise Technology | TBD |
| Jean-Philippe Aguère | Mondragon Assembly | TBD |
| Caroline Grand | Dow | TBD |
| 14:20 - 15:50 | | | Session V: Low temperature interconnection |
| Nathalie Ronayette | CEA INES | Novel techniques to characterise Electrically Conductive Adhesives |
| Derya Gldali | FhISE | Interconnection of Low-temperature Metallization on Silicon Solar Cells - the Role of Silver in Tin-Bismuth-based Solder Alloys |
| Tobias Meßmer | ISC Konstanz | Separation of Electrical Contact and Mechanical Adhesion for Busbarless Interconnection |
| Felicia Mouhoubi | CEA INES | Characterization of Electrically Conductive Adhesives (ECA) for interconnection of Perovskite/Silicon tandem solar cells |
| 15:50 - 17:20 | | | Market Place Discussions + Coffee |
| From 17:30 | | | Aperitif & Dinner |
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| Thursday, October 24, 2024 |
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| 8:00 - 8:30 | | | Registration and Coffee |
| 8:30 - 9:00 | | | Wrap - Up Market Place Discussions |
| 9:00 - 10:30 | | | Session VI: Ag reduction and low temperature metallization |
| Linjia Zhang | Suzhou iSilver Materials Co. | Research and development of low temperature paste for heterojunction and perovskite cells |
| Jonas Bartsch | FhISE | The Transition to Copper ? Current Ideas and Approaches at Fraunhofer ISE |
| Rémi Monna | CEA INES | Use of Cu ribbons and CuAg HJT cell metallization on ECA based interconnection |
| Sebastian Pingel | FhISE | Transition From Silver- to Copper-Based Screen Printed SHJ Solar Cells |
| 10:30 - 10:50 | | | Coffee break |
| 10:50 - 11:50 | | | Session VII: Poster session B |
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| 11:50 - 13:00 | | | Session VIII: New materials for advanced solar cells |
| Veysel Unsur | NEU / ODTU-GUNAM | Enhanced Performance of Silicon Solar Cells with Nano Silver-Doped Self-Passivating Nickel Contacts |
| Leonie Jakob | FhISE | Multifunctional Ti(Al)Ox Layers for Silver- and Indium-free SHJ / Si-Perovskite Solar Cells |
| Cesar Manna | PVNanocell | Enabling sub 15 micron hyperfine lines using Ag nanoparticle based pastes for low temperature solar cell applications to achieve cost reduction and faster throughput using different patterning technologies. |
| 13:00 - 14:00 | | | Lunch break |
| 14:00 - 15:10 | | | Session IX: Advances for screen printing in manufacturing |
| Marius Singler | FhISE | Deep Learning-Based Prediction of 3-dimensional Silver Contact Shapes Enabling Improved Quality Control in Solar Cell Metallization |
| Tokiko Misaki | Asada Mesh | Screen-printed Pattern Positioning Accuracy Affected by Mechanical Properties of Screen Mesh |
| Jan Lossen | ISC Konstanz | Screen-printed Cu-TOPCon cells with reduced Ag content |
| 15:10 - 15:30 | | | Closing and Goodbye |
| 15:30 - 17:30 | | | Networking and tour of CEA INES |
