| Sunday, October 19, 2025 | | |
| From 18:00 | | | Welcome reception | | |
| Monday, October 20, 2025 | | |
| 08:00 -8h30 | | | Registration and coffee | | |
| 08:30 - 08:40 | | | Opening (MIW2025 organizers) | | |
| 08:40 - 08:50 | | | Introductory talk by HZB | | |
| 08:50 - 10:10 | | | Session I: Progress in industrial metallization technologies | | |
| Keynote | Jun Zhao | CSEM | Updates of recent metallization development from Chinese mass production | | |
| Ning Chen | Wuxi Autowell Technology | The Application of Stencil Printing in Industrial Solar Cells in 2025 | | |
| Sebastian Tepner | EKRA Automatisierungssysteme GmbH | Introducing a 1.2GW metallization line utilizing a novel screen-printing approach with a throughput of 13500 wafer per hour | | |
| 10:10 - 10:30 | | | Coffee break | | |
| 10:30 - 11:30 | | | Session II: Poster session A | | |
| 11:30 - 13:00 | | | Session III: Advances in interconnection | | |
| Hamed Javanbakht Lomeri | imec | Towards Sustainable SHJ Module Fabrication: Multiwire TWILL Interconnection for Copper-based Metallization and Indium-Free Transparent Conductive Oxides | | |
| Nathalie Ronayette-Lamoine | CEA INES | Towards less than 10 mg/Wp silver consumption in HJT modules with ECA based interconnection | | |
| Derya Güldali | Fraunhofer ISE | RoHS-Compliant Interconnection of TOPCon Solar Cells: Feasibility and Performance Evaluation of SnAgCu Solder Alloy | | |
| Jonas Eckert | Fraunhofer ISE | Contact adhesion mechanism of plated contacts on industrial TOPCon rear sides – Microstructure analysis and module integration | | |
| 13.00 - 14.00 | | | Lunch break | | |
| 14:00 - 14:40 | | | Session IV: Industry Session | | |
| | iSilver | Cost reduction of low-temperature silver paste and its application in various photovoltaic cells | | |
| | Henkel | TBD | | |
| | Mondragon | TBD | | |
| | Gonda | TBD | | |
| | Dow | TBD | | |
| 14:40 - 15:00 | | | Coffee break | | |
| 15:00 - 16:30 | | | Session V: Metallization by plating | | |
| Jonas Bartsch | Fraunhofer ISE | Plating as metallization method in photovoltaics – properties, developments and applications | | |
| Agata Lachowicz | CSEM | Reduction of silver and indium consumption by copper plating with a dielectric masking layer for sustainable production of heterojunction cells | | |
| G. Rodrigues Lopes | CEA INES | Seed-Layer-Free Electroplated Copper Metallization of SHJ Cells Enabled by Chemical Modification of Transparent Conductive Oxides | | |
| Thibaud Hatt | PV2+ | Bifacial TBC polyZEBRA Solar Cell meets PV2+’s copper plating metallization | | |
| 16:30 - 17:30 | | | Market Place Discussions | | |
| From 17:30 | | | Aperitif & Dinner | | |
| Tuesday, October 21, 2025 | | |
| 8:30 - 9:00 | | | Wrap - Up Market Place Discussions | | |
| 9:00 - 10:10 | | | Session VI: Transition towards Cu paste metallization | | |
| Sebastian Pingel | Fraunhofer ISE | Efficient Silver Usage in Screen-Printed SHJ Cells for the Terawatt Production Era | | |
| Thad Druffel | Bert Thin Films | LECO Processing of Copper Pastes | | |
| Oumaima Mhirsi | Fraunhofer ISE | Unveiling Mechanistic Differences in the Curing of Copper and Silver Pastes for Heterojunction Solar Cells | | |
| 10:10 - 10:40 | | | Coffee break | | |
| 10:40 - 11:40 | | | Session VII: Poster session B | | |
| 11:40 - 12:50 | | | Session VIII: Progress and understanding of screen printed contacts | | |
| | | session chairs: | | |
| Andreas Lorenz | Fraunhofer ISE | Advancements in Fine Line Metallization: Latest Achievements at Fraunhofer ISE | | |
| Yuelin Xiong | University of Oxford | A Failure Mode Affecting the Reliability of LECO Metallised High-Efficiency TOPCon Solar Cells | | |
| Aathira Nair | Fraunhofer ISE | Progress on reducing contact width in solar cell metallization by optimized laser processing during screen production | | |
| 12:50 - 13:50 | | | Lunch break | | |
| 13:50 - 15:20 | Shared session with Pepperoni | Session IX: Metallization and Interconnection for Si-perovskite tandem solar cells | | |
| Valérie Depauw | imec | Multwire Interconnection with SnBi Alloy for Perovskite/Silicon Tandems | | |
| Yanxin Liu | Forschungszentrum Jülich | Room-Temperature Interconnection of Thermally Sensitive Solar Cells Using Electrically Conductive Tape | | |
| Tillman Finger | Karlsruhe Institute for Technology | T-ECA – Thermoplastic Adhesives for Solar Cell Interconnection | | |
| Freya Leyland | HZB | Investigating barrier properties of TCOs against metallization and interconnection materials for thermal stability of perovskite-based solar cells | | |
| 15:20 - 15:30 | | | Closing and Goodbye | | |
| 15:30 - | | | Networking with coffee and lab tours | | |
| 15:30 - | | | Networking with coffee and lab tours | | |
