| Sunday, November 14, 2021 | |
| 19:00 - 21:00 | | Reception at M Hotel, Genk |
| | | |
| Monday, November 15, 2021 | |
| 09:00 - 09:15 | | Welcome (Mayor of Genk) |
| 09:15 - 09:30 | | Opening (MIW2021 organizers) |
| 09:30 - 10:45 | | Session I: Understanding of screenprinted contacts |
| | | session chair 1: Thomas Buck (ISC Konstanz)
session chair 2: Maximilian Pospischil (HighLite Technologies) |
| Eve Krassowski | CE Cell Engineering GmbH | Investigation of impact of cell properties on LECO effectiveness using off-spec PERC cells of different manufacturers on MK4 platform |
| Mengmeng Deng | EPFL | Understanding and insight of paste formulation and curing behavior with sub-100-nanometer Ag-Cu core-shell nanoparticles |
| Pradeep Padhamnath | SERIS | Modeling of contact resistivity of fire-through Ag-Al contacts to boron doped poly-Si |
| 10:45 - 11:15 | | Coffee break |
| 11:15 - 12:45 | | Session II: Shingling interconnection |
| | | session chair 1: Samuel Harrisson (CEA INES)
session chair 2: Marco Galliazzo (AMAT) |
| Marc Estruga | Henkel | Acrylate-, Epoxy- and Silicone-based electrically conductive adhesives as interconnection material in shingled module technology |
| Daniel von Kutzleben | F-ISE | Progress in shingle interconnection based on electrically conductive adhesives at Fraunhofer ISE |
| María Ignacia Devoto | ISC | Contact resistivity of ECA-based joints: How to extrapolate it? |
| Margit Lang | PCCL | FEM simulation of deformations and stresses in strings of shingled solar cells under mechanical and thermal loading |
| 12:45 - 14:00 | | Lunch break |
| 14:00 - 15:30 | | Energyville tour 1 (max. 60 persons) or Networking |
| 15:30 - 17:15 | | Session III: Advanced printing techniques |
| | | session chair 1: Jan Lossen (ISC Konstanz)
session chair 2: Thibaud Hatt (Fraunhofer ISE) |
| Marco Galiazzo | AMAT | Evaluation of different approaches for HJT cells metallization based on low temperature pastes |
| Karim Abdel Aal | KIT | Effect of the addition of a slip agent to the bulk phase on the transfer properties of solar cell front site metallization pastes |
| Antonin Faes | CSEM | Ink-jet printing of silicon heterojunction: from cell power to module reliability |
| Andreas Lorenz | F-ISE | Progress with Rotary Screen Printed Fine Line Metallization for Silicon Heterojunction Solar Cells |
| Maximilian Pospischil | HighLine Technology | Fully automated intermittent parallel dispensing |
| 17:15 - 18:30 | | Market Place Discussions & Transfer |
| From 18:30 | | Aperitif & Dinner |
| | | |
| Tuesday, November 16, 2021 | |
| 09:00 - 09:30 | | Wrap - Up Market Place Discussions |
| 09:30 - 11:00 | | Session IV: Cu plated contacts |
| | | session chair 1: Loic Tous (imec)
session chair 2: Antonin Faes (CSEM) |
| Bertrand Paviet-Salomon | CSEM | Reinforcement of screen-printed copper paste by electrodeposited copper for metallization of heterojunction solar cells |
| Thibaud Hatt | F-ISE | Copper electroplating for SHJ solar cells - Adequate contact by electrolyte tuning |
| Can Han | TU Delft | Controllable simultaneous bifacial Cu-plating for high efficiency crystalline silicon solar cell |
| Thibaud Hatt | F-ISE | 23.6 % Efficient Bifacial i-TOPCon Silicon Solar Cells with < 20 mu Wide Ni/Cu/Ag-Plated Contact Fingers |
| 11:00 - 11:30 | | Coffee break |
| 11:30 - 12:45 | | Session V: Multi-BB interconnection |
| | | session chair 1: Guy Beaucarne (Dow)
session chair 2: Andreas Schneider (ISC Konstanz) |
| Veronika Nikitina | F-ISE | High Speed Characterization of Electrically Conductive Adhesives for Industrial SHJ Solar Cell Ribbon Interconnection |
| Vincent Barth | CEA-INES | Innovative industrial strategy based on Electrically Conductive Adhesive for HJT solar cells |
| Li Carlos Rendler | F-ISE | Wave shaped wires for the interconnection of silicon solar cells without busbars or contact pads |
| | | |
| 12:45 - 14:15 | | Lunch break |
| 14:15 - 15:45 | | Session VI: Metallization of advanced cell concepts |
| | | session chair 1: Ansgar Mette (Q-Cells)
session chair 2: Thorsten Dullweber (ISFH) |
| Andreas Nägele | F-ISE | FOILMET©-CONNECT: Upgrading Adhesion by Employment of LMB |
| Dominik Rudolph | ISC | Screen printable, non-fire-through copper paste applied as busbar metallization for back contact solar cells |
| Juan Diaz Leon | CSEM | Sputtered polySi(n) passivating contacts compatible with direct metallization |
| Martin Bivour | F-ISE | Challenges and Perspectives for the TCO and Metal Electrodes in Perovskite-Silicon Tandem Solar Cells: Performance and Scalability |
| 15:45 - 16:00 | | Closing and Goodbye |
| 16:00 - 17:30 | | Energyville tour 2 (max. 60 persons) or Networking |
