The workshop program includes oral and poster presentations that address the following main topics:
- Metallization fundamentals: insights, limits, understanding, modelling
- Progress in screen printing and alternative deposition methods
- Current-fired contacts (CFC) / Laser enhanced contact optimization (LECO)
- Novel paste formulation (incl. Cu, Al) and novel screen types
- Metallization for advanced cell concepts (e.g. TOPCon, SHJ, IBC)
- Metallization of Perovskite-based solar cells
- Progress in multi bus bar, multi wire and alternative interconnection approaches
- Shingling and other zero busbar interconnection (0BB) schemes
- Low temperature soldering technologies
- Conductive adhesive based interconnections : materials and technology
- Durability and degradation issues of metallization and interconnection
- Advanced characterization, simulation and modelling of metallization and interconnection processes
- Availability and sustainability of metals, recycling and circular economy
A lot of room will be given for discussion during the workshop.
Please note that, just like for previous editions, presenters will have the opportunity after the workshop to submit a paper, which will be published after per review in as special issue in a journal.
