| General Presentations |
| MIW organizors, Opening of MIW2021 |
| Chairs of market place discussion, Wrap-Up of Market Place Discussions |
| Session I: Understanding of screenprinted contacts |
| Eve Krassowski, CE Cell Engineering GmbH, Investigation of impact of cell properties on LECO effectiveness using off-spec PERC cells of different manufacturers on MK4 platform |
| Mengmeng Deng, EPFL, Understanding and insight of paste formulation and curing behavior with sub-100-nanometer Ag-Cu core-shell nanoparticles |
| Pradeep Padhamnath, SERIS, Modeling of contact resistivity of fire-through Ag-Al contacts to boron doped poly-Si |
| Session II: Shingling interconnection |
| Marc Estruga, Henkel, Acrylate-, Epoxy- and Silicone-based electrically conductive adhesives as interconnection material in shingled module technology |
| Daniel von Kutzleben, F-ISE, Progress in shingle interconnection based on electrically conductive adhesives at Fraunhofer ISE |
| María Ignacia Devoto, ISC, Contact resistivity of ECA-based joints: How to extrapolate it? |
| Margit Lang, PCCL, FEM simulation of deformations and stresses in strings of shingled solar cells under mechanical and thermal loading |
| Session III: Advanced printing techniques |
| Marco Galiazzo, AMAT, Evaluation of different approaches for HJT cells metallization based on low temperature pastes |
| Karim Abdel Aal, KIT, Effect of the addition of a slip agent to the bulk phase on the transfer properties of solar cell front site metallization pastes |
| Antonin Faes, CSEM, Ink-jet printing of silicon heterojunction: from cell power to module reliability |
| Andreas Lorenz, F-ISE, Progress with Rotary Screen Printed Fine Line Metallization for Silicon Heterojunction Solar Cells |
| Maximilian Pospischil, HighLine Technology, Fully automated intermittent parallel dispensing |
| Session IV: Cu plated contacts |
| Bertrand Paviet-Salomon, CSEM, Reinforcement of screen-printed copper paste by electrodeposited copper for metallization of heterojunction solar cells |
| Thibaud Hatt, F-ISE, Copper electroplating for SHJ solar cells – Adequate contact by electrolyte tuning |
| Can Han, TU Delft, Controllable simultaneous bifacial Cu-plating for high efficiency crystalline silicon solar cell |
| Christian Schmiga, F-ISE, 23.6 % Efficient Bifacial i-TOPCon Silicon Solar Cells with < 20 μm Wide Ni/Cu/Ag-Plated Contact Fingers |
| Session V: Multi-BB interconnection |
| Veronika Nikitina, F-ISE, High Speed Characterization of Electrically Conductive Adhesives for Industrial SHJ Solar Cell Ribbon Interconnection |
| Vincent Barth, CEA-INES, Innovative industrial strategy based on Electrically Conductive Adhesive for HJT solar cells |
| Li Carlos Rendler, F-ISE, Wave shaped wires for the interconnection of silicon solar cells without busbars or contact pads |
| Session VI: Metallization of advanced cell concepts |
| Andreas Nägele, F-ISE, FOILMET®-CONNECT: Upgrading Adhesion by Employment of LMB |
| Dominik Rudolph, ISC, Screen printable, non-fire-through copper paste applied as busbar metallization for back contact solar cells |
| Juan Diaz Leon, EFPL, Sputtered polySi(n) passivating contacts compatible with direct metallization |
| Martin Bivour, F-ISE, Challenges and Perspectives for the TCO and Metal Electrodes in Perovskite-Silicon Tandem Solar Cells: Performance and Scalability |
