General Presentations |
MIW organizors, Opening of MIW2021 |
Chairs of market place discussion, Wrap-Up of Market Place Discussions |
Session I: Understanding of screenprinted contacts |
Eve Krassowski, CE Cell Engineering GmbH, Investigation of impact of cell properties on LECO effectiveness using off-spec PERC cells of different manufacturers on MK4 platform |
Mengmeng Deng, EPFL, Understanding and insight of paste formulation and curing behavior with sub-100-nanometer Ag-Cu core-shell nanoparticles |
Pradeep Padhamnath, SERIS, Modeling of contact resistivity of fire-through Ag-Al contacts to boron doped poly-Si |
Session II: Shingling interconnection |
Marc Estruga, Henkel, Acrylate-, Epoxy- and Silicone-based electrically conductive adhesives as interconnection material in shingled module technology |
Daniel von Kutzleben, F-ISE, Progress in shingle interconnection based on electrically conductive adhesives at Fraunhofer ISE |
María Ignacia Devoto, ISC, Contact resistivity of ECA-based joints: How to extrapolate it? |
Margit Lang, PCCL, FEM simulation of deformations and stresses in strings of shingled solar cells under mechanical and thermal loading |
Session III: Advanced printing techniques |
Marco Galiazzo, AMAT, Evaluation of different approaches for HJT cells metallization based on low temperature pastes |
Karim Abdel Aal, KIT, Effect of the addition of a slip agent to the bulk phase on the transfer properties of solar cell front site metallization pastes |
Antonin Faes, CSEM, Ink-jet printing of silicon heterojunction: from cell power to module reliability |
Andreas Lorenz, F-ISE, Progress with Rotary Screen Printed Fine Line Metallization for Silicon Heterojunction Solar Cells |
Maximilian Pospischil, HighLine Technology, Fully automated intermittent parallel dispensing |
Session IV: Cu plated contacts |
Bertrand Paviet-Salomon, CSEM, Reinforcement of screen-printed copper paste by electrodeposited copper for metallization of heterojunction solar cells |
Thibaud Hatt, F-ISE, Copper electroplating for SHJ solar cells – Adequate contact by electrolyte tuning |
Can Han, TU Delft, Controllable simultaneous bifacial Cu-plating for high efficiency crystalline silicon solar cell |
Christian Schmiga, F-ISE, 23.6 % Efficient Bifacial i-TOPCon Silicon Solar Cells with < 20 μm Wide Ni/Cu/Ag-Plated Contact Fingers |
Session V: Multi-BB interconnection |
Veronika Nikitina, F-ISE, High Speed Characterization of Electrically Conductive Adhesives for Industrial SHJ Solar Cell Ribbon Interconnection |
Vincent Barth, CEA-INES, Innovative industrial strategy based on Electrically Conductive Adhesive for HJT solar cells |
Li Carlos Rendler, F-ISE, Wave shaped wires for the interconnection of silicon solar cells without busbars or contact pads |
Session VI: Metallization of advanced cell concepts |
Andreas Nägele, F-ISE, FOILMET®-CONNECT: Upgrading Adhesion by Employment of LMB |
Dominik Rudolph, ISC, Screen printable, non-fire-through copper paste applied as busbar metallization for back contact solar cells |
Juan Diaz Leon, EFPL, Sputtered polySi(n) passivating contacts compatible with direct metallization |
Martin Bivour, F-ISE, Challenges and Perspectives for the TCO and Metal Electrodes in Perovskite-Silicon Tandem Solar Cells: Performance and Scalability |