PRESENTATIONS 2021 General Presentations MIW organizors, Opening of MIW2021 Chairs of market place discussion, Wrap-Up of Market Place Discussions Session I: Understanding of screenprinted contacts Eve Krassowski, CE Cell Engineering GmbH, Investigation of impact of cell properties on LECO effectiveness using off-spec PERC cells of different manufacturers on MK4 platform Mengmeng Deng, EPFL, Understanding and insight of paste formulation and curing behavior with sub-100-nanometer Ag-Cu core-shell nanoparticles Pradeep Padhamnath, SERIS, Modeling of contact resistivity of fire-through Ag-Al contacts to boron doped poly-Si Session II: Shingling interconnection Marc Estruga, Henkel, Acrylate-, Epoxy- and Silicone-based electrically conductive adhesives as interconnection material in shingled module technology Daniel von Kutzleben, F-ISE, Progress in shingle interconnection based on electrically conductive adhesives at Fraunhofer ISE María Ignacia Devoto, ISC, Contact resistivity of ECA-based joints: How to extrapolate it? Margit Lang, PCCL, FEM simulation of deformations and stresses in strings of shingled solar cells under mechanical and thermal loading Session III: Advanced printing techniques Marco Galiazzo, AMAT, Evaluation of different approaches for HJT cells metallization based on low temperature pastes Karim Abdel Aal, KIT, Effect of the addition of a slip agent to the bulk phase on the transfer properties of solar cell front site metallization pastes Antonin Faes, CSEM, Ink-jet printing of silicon heterojunction: from cell power to module reliability Andreas Lorenz, F-ISE, Progress with Rotary Screen Printed Fine Line Metallization for Silicon Heterojunction Solar Cells Maximilian Pospischil, HighLine Technology, Fully automated intermittent parallel dispensing Session IV: Cu plated contacts Bertrand Paviet-Salomon, CSEM, Reinforcement of screen-printed copper paste by electrodeposited copper for metallization of heterojunction solar cells Thibaud Hatt, F-ISE, Copper electroplating for SHJ solar cells – Adequate contact by electrolyte tuning Can Han, TU Delft, Controllable simultaneous bifacial Cu-plating for high efficiency crystalline silicon solar cell Christian Schmiga, F-ISE, 23.6 % Efficient Bifacial i-TOPCon Silicon Solar Cells with < 20 μm Wide Ni/Cu/Ag-Plated Contact Fingers Session V: Multi-BB interconnection Veronika Nikitina, F-ISE, High Speed Characterization of Electrically Conductive Adhesives for Industrial SHJ Solar Cell Ribbon Interconnection Vincent Barth, CEA-INES, Innovative industrial strategy based on Electrically Conductive Adhesive for HJT solar cells Li Carlos Rendler, F-ISE, Wave shaped wires for the interconnection of silicon solar cells without busbars or contact pads Session VI: Metallization of advanced cell concepts Andreas Nägele, F-ISE, FOILMET®-CONNECT: Upgrading Adhesion by Employment of LMB Dominik Rudolph, ISC, Screen printable, non-fire-through copper paste applied as busbar metallization for back contact solar cells Juan Diaz Leon, EFPL, Sputtered polySi(n) passivating contacts compatible with direct metallization Martin Bivour, F-ISE, Challenges and Perspectives for the TCO and Metal Electrodes in Perovskite-Silicon Tandem Solar Cells: Performance and Scalability
