General |
MIW Organizors, Opening |
David Duca, CEA INES, Introductory talk |
Chairs, Wrap-Up Marketplace Discussion |
Session I: Screen-printed metallisation |
Eve Krassowski, Cell Engineering, Are LECO induced Current Fired Contacts stable over the lifetime of a solar module? – a microstructural assessment |
Ning Chen, Wuxi Autowell Technology, Review of the latest industrial progress in screen printing |
Saman Sharbaf Kalaghichi, ISC Konstanz, Progress in contacting boron doped poly Si layers for advanced passivated contact solar cells |
Session III: Plated metallization |
Jonas Eckert , FhISE, Understanding Direct contact Plating for industry level bifacial TOPCon solar cells |
Torsten Voss, Atotech GmbH, Formation of durable silicon/metal interface on TOPCon cells by plated metallization |
Bertrand Paviet-Salomon, CSEM, Copper Electrodeposition on Industrial M10 Heterojunction and on TOPCon Cells |
Session IV: Industry Session |
Marco Galiazzo, Applied Materials, Advancements in Equipment and Process for PV metallization |
Marco Balucani, Rise Technology, iSPLASH: Selective PLAting for Solar Heterojunction |
Jean-Philippe Aguerre, Mondragon Assembly, Flexible Tool Solutions for Innovative PV Interconnection |
Guy Beaucarne, Dow, Encapsulation Materials: Why Talk about Polymers at the MIW? |
Session V: Low temperature interconnection |
Nathalie Ronayette, CEA INES, Novel techniques to characterise Electrically Conductive Adhesives |
Derya Güldali, FhISE, Interconnection of Low-temperature Metallization on Silicon Solar Cells – the Role of Silver in Tin-Bismuth-based Solder Alloys |
Tobias Meßmer, ISC Konstanz, Separation of Electrical Contact and Mechanical Adhesion for Busbarless Interconnection |
Felicia Mouhoubi, CEA INES, Characterization of Electrically Conductive Adhesives (ECA) for interconnection of Perovskite/Silicon tandem solar cells |
Session VI: Ag reduction and low temperature metallization |
Linjia Zhang, Suzhou iSilver Materials Co., Research and development of low temperature paste for heterojunction and perovskite cells |
Jonas Bartsch, FhISE, The Transition to Copper – Current Ideas and Approaches at Fraunhofer ISE |
Rémi Monna, CEA INES, Use of Cu ribbons and CuAg HJT cell metallization on ECA based interconnection |
Sebastian Pingel, FhISE, Transition From Silver- to Copper-Based Screen Printed SHJ Solar Cells |
Session VIII: New materials for advanced solar cells |
Veysel Unsur, Necmettin Erbakan University, Enhanced Performance of Silicon Solar Cells with Nano Silver-Doped Self-Passivating Nickel Contacts |
Jonas Bartsch, FhISE, Multifunctional Ti(Al)Ox Layers for Silver- and Indium-free SHJ / Si-Perovskite Solar Cells |
Cesar Manna, PVNanocell, Enabling sub 15 micron hyperfine lines using Ag nanoparticle based pastes for low temperature solar cell applications to achieve cost reduction and faster throughput using different patterning technologies. |
Session IX: Advances for screen printing in manufacturing |
Marius Singler, FhISE, Deep Learning-Based Prediction of 3-dimensional Silver Contact Shapes Enabling Improved Quality Control in Solar Cell Metallization |
Tokiko Misaki, Asada Mesh , Screen-printed Pattern Positioning Accuracy Affected by Mechanical Properties of Screen Mesh |
Jan Lossen, ISC Konstanz, Screen-printed Cu-TOPCon cells with reduced Ag content |
Poster Session A |
María Ignacia Devoto Acevedo, ISC Konstanz, Effects of carbon nanotubes in conductive adhesives for photovoltaics |
Jörg Schube, Fraunhofer ISE, High-Throughput Indirect Gravure Printing of Low-Temperature Metallization |
Thad Druffel, Bert Thin Films, Reliability of c-Silicon cells using Screen-Printed Copper Contacts Fired in Air |
Abasifreke Ebong, University of North Carolina at Charlotte, Characterization of a screen-printed copper-grid-silicon interface on PERC silicon solar cell |
Bertrand Hladys, CEA-INES, Characterization of low temperature paste for HJT application |
Thien Truong, National Renewable Energy Laboratory, Low-cost reactive Ag inks for high-efficiency silicon solar cells deposited via screen- and inkjet- printing |
Jonas Albrecht, HighLine Technology GmbH, PARALLEL DISPENSING FOR CELL AND MODULE |
Louis Jacques, CSEM SA / EPFL PV-Lab, Stress Tolerance of Novel, Lightweight, Curved PV Modules for Vehicle Integration |
Thomas Buck, ISC Konstanz, Approaches for Al metallisation on solar cell concepts beyond PERC structures |
Bartlomiej Fligier, AGH University of Krakow, Design, fabrication and analysis of lightweight and flexible c-Si Photovoltaic modules for solar powered vehicles |
Thibaud Hatt, PV2+ GmbH, Self-passivated sputtered metallic mask for copper plating metallization on solar cells |
Poster Session B |
Marianne Kronsbein, Karlsruhe Institute for Technology, Potential of Low-Filled Electrically Conductive Adhesives for Shingled Solar Cell Interconnection |
Adeline Lanterne, CEA, Liten, INES, Copper-plating metallization of low-indium heterojunction solar cells |
Gustavo Rodrigues Lopes, INES (Institut National de l’Energie Solaire) / CEA Grenoble, Evaluation of pure copper conductive pastes by screen-printing for a-Si:H/c-Si heterojunction solar cells |
Aathira Krishnadas Nair, Fraunhofer Institute for Solar Energy Systems (ISE), Enhancing Solar Cell Metallization through Laser-Optimized Screen-Printing Technology |
Mertcan Comak, ISC Konstanz, Distortion of knotless printing screens during usage |
Hüseyin Utkucan Kayacı, Nanovatif Materials Technologies, Water-Based Electrically Conductive Adhesive for PERC-Type Shingled Solar Cells |
Pradeep Padhamnath, AGH University of Krakow, Recycling end-of-life c-Si photovoltaic panels – recovery of high-quality silicon and other valuable materials |
Jonas Valentijn, University of Twente, High aspect ratio front contacts for solar cells using string printing |