PRESENTATIONS MIW 2024

Presentations and Posters showed at MIW2024 on 23rd and 24th October 2024 in Chambéry

            

 General 
 MIW Organizors, Opening 
 David Duca, CEA INES, Introductory talk  
 Chairs, Wrap-Up Marketplace Discussion 
 Session I:  Screen-printed metallisation 
 Eve Krassowski, Cell Engineering, Are LECO induced Current Fired Contacts stable over the lifetime of a solar module? – a microstructural assessment
 Ning Chen, Wuxi Autowell Technology, Review of the latest industrial progress in screen printing 
 Saman Sharbaf Kalaghichi, ISC Konstanz, Progress in contacting boron doped poly Si layers for advanced passivated contact solar cells 
 Session III: Plated metallization 
 Jonas Eckert , FhISE, Understanding Direct contact Plating for industry level bifacial TOPCon solar cells 
 Torsten Voss, Atotech GmbH, Formation of durable silicon/metal interface on TOPCon cells by plated metallization 
 Bertrand Paviet-Salomon, CSEM, Copper Electrodeposition on Industrial M10 Heterojunction and on TOPCon Cells 
 Session IV: Industry Session 
 Marco Galiazzo, Applied Materials, Advancements in Equipment and Process for PV metallization 
 Marco Balucani, Rise Technology, iSPLASH: Selective PLAting for Solar Heterojunction 
 Jean-Philippe Aguerre, Mondragon Assembly, Flexible Tool Solutions for Innovative PV Interconnection 
 Guy Beaucarne, Dow, Encapsulation Materials: Why Talk about Polymers at the MIW? 
 Session V: Low temperature interconnection 
 Nathalie Ronayette, CEA INES, Novel techniques to characterise Electrically Conductive Adhesives 
 Derya Güldali, FhISE, Interconnection of Low-temperature Metallization on Silicon Solar Cells – the Role of Silver in Tin-Bismuth-based Solder Alloys 
 Tobias Meßmer, ISC Konstanz, Separation of Electrical Contact and Mechanical Adhesion for Busbarless Interconnection 
 Felicia Mouhoubi, CEA INES, Characterization of Electrically Conductive Adhesives (ECA) for interconnection of Perovskite/Silicon tandem solar cells 
 Session VI: Ag reduction and low temperature metallization 
 Linjia Zhang, Suzhou iSilver Materials Co., Research and development of low temperature paste for heterojunction and perovskite cells 
 Jonas Bartsch, FhISE, The Transition to Copper – Current Ideas and Approaches at Fraunhofer ISE 
 Rémi Monna, CEA INES, Use of Cu ribbons and CuAg HJT cell metallization on ECA based interconnection 
 Sebastian Pingel, FhISE, Transition From Silver- to Copper-Based Screen Printed SHJ Solar Cells 
 Session VIII: New materials for advanced solar cells 
 Veysel Unsur, Necmettin Erbakan University, Enhanced Performance of Silicon Solar Cells with Nano Silver-Doped Self-Passivating Nickel Contacts 
 Jonas Bartsch, FhISE, Multifunctional Ti(Al)Ox Layers for Silver- and Indium-free SHJ / Si-Perovskite Solar Cells 
 Cesar Manna, PVNanocell, Enabling sub 15 micron hyperfine lines using Ag nanoparticle based pastes for low temperature solar cell applications to achieve cost reduction and faster throughput using different patterning technologies. 
 Session IX:  Advances for screen printing in manufacturing 
 Marius Singler, FhISE, Deep Learning-Based Prediction of 3-dimensional Silver Contact Shapes Enabling Improved Quality Control in Solar Cell Metallization 
 Tokiko Misaki, Asada Mesh , Screen-printed Pattern Positioning Accuracy Affected by Mechanical Properties of Screen Mesh 
 Jan Lossen, ISC Konstanz, Screen-printed Cu-TOPCon cells with reduced Ag content 
 Poster Session A 
 María Ignacia Devoto Acevedo, ISC Konstanz, Effects of carbon nanotubes in conductive adhesives for photovoltaics 
 Jörg Schube, Fraunhofer ISE, High-Throughput Indirect Gravure Printing of Low-Temperature Metallization 
 Thad Druffel, Bert Thin Films, Reliability of c-Silicon cells using Screen-Printed Copper Contacts Fired in Air 
 Abasifreke Ebong, University of North Carolina at Charlotte, Characterization of a screen-printed copper-grid-silicon interface on PERC silicon solar cell 
 Bertrand Hladys, CEA-INES, Characterization of low temperature paste for HJT application 
 Thien Truong, National Renewable Energy Laboratory, Low-cost reactive Ag inks for high-efficiency silicon solar cells deposited via screen- and inkjet- printing 
Jonas Albrecht, HighLine Technology GmbH, PARALLEL DISPENSING FOR CELL AND MODULE 
 Louis Jacques, CSEM SA / EPFL PV-Lab, Stress Tolerance of Novel, Lightweight, Curved PV Modules for Vehicle Integration 
 Thomas Buck, ISC Konstanz, Approaches for Al metallisation on solar cell concepts beyond PERC structures 
 Bartlomiej Fligier, AGH University of Krakow, Design, fabrication and analysis of lightweight and flexible c-Si Photovoltaic modules for solar powered vehicles 
 Thibaud Hatt, PV2+ GmbH, Self-passivated sputtered metallic mask for copper plating metallization on solar cells 
 Poster Session B 
 Marianne Kronsbein, Karlsruhe Institute for Technology, Potential of Low-Filled Electrically Conductive Adhesives for Shingled Solar Cell Interconnection 
 Adeline Lanterne, CEA, Liten, INES, Copper-plating metallization of low-indium heterojunction solar cells 
 Gustavo Rodrigues Lopes, INES (Institut National de l’Energie Solaire) / CEA Grenoble, Evaluation of pure copper conductive pastes by screen-printing for a-Si:H/c-Si heterojunction solar cells 
 Aathira Krishnadas Nair, Fraunhofer Institute for Solar Energy Systems (ISE), Enhancing Solar Cell Metallization through Laser-Optimized Screen-Printing Technology 
 Mertcan Comak, ISC Konstanz, Distortion of knotless printing screens during usage 
 Hüseyin Utkucan Kayacı, Nanovatif Materials Technologies, Water-Based Electrically Conductive Adhesive for PERC-Type Shingled Solar Cells 
 Pradeep Padhamnath, AGH University of Krakow, Recycling end-of-life c-Si photovoltaic panels – recovery of high-quality silicon and other valuable materials 
 Jonas Valentijn, University of Twente,  High aspect ratio front contacts for solar cells using string printing