| MIW Organizors, Workshop opening |
| Bernd Stannowski, , Introductory talk by HZB |
| Session I: Progress in industrial metallization technologies |
| Jun Zhao, CSEM, Updates of recent metallization development from Chinese mass production |
| Ning Chen, Wuxi Autowell Technology, Printing Technologies for PV: Beyond Metal Pastes and Stainless Steel Screens |
| Sebastian Tepner, EKRA Automatisierungssysteme GmbH, Introducing a 1.2GW metallization line utilizing a novel screen-printing approach with a throughput of 13500 wafer per hour |
| Session III: Advances in interconnection |
| Hamed Javanbakht Lomeri, imec, Towards Sustainable SHJ Module Fabrication: Multiwire TWILL Interconnection for Copper-based Metallization and Indium-Free Transparent Conductive Oxides |
| Rémi Monna, CEA INES, Towards less than 10 mg/Wp silver consumption in HJT modules with ECA based interconnection |
| Derya Güldali, Fraunhofer ISE, RoHS-Compliant Interconnection of TOPCon Solar Cells: Feasibility and Performance Evaluation of SnAgCu Solder Alloy |
| Jonas Eckert, Fraunhofer ISE, Contact adhesion mechanism of plated contacts on industrial TOPCon rear sides – Microstructure analysis and module integration |
| Session IV: Industry Session |
| Jerry Cao, iSilver, Cost reduction of low-temperature silver paste and its application in various photovoltaic cells |
| Tobias Nitsche, Henkel, Enabling sustainable PV production with low-temperature snap curable electrically conductive adhesives |
| Jean-Philippe Aguerre, Mondragon, Tool Solutions for Innovative PV Interconnection |
| Weiming Zhang, Gonda, Metallization Paste Development and Progress for TOPCon Cells |
| Guy Beaucarne, Dow, Materials matter: Impact of module materials on metallization and interconnection |
| Session V: Metallization by plating |
| Jonas Bartsch, Fraunhofer ISE, Plating as metallization method in photovoltaics – properties, developments and applications |
| Audrey Morisset, CSEM, Reduction of silver and indium consumption by copper plating with a dielectric masking layer for sustainable production of heterojunction cells |
| G. Rodrigues Lopes, CEA INES, Seed-Layer-Free Electroplated Copper Metallization of SHJ Cells Enabled by Chemical Modification of Transparent Conductive Oxides |
| Markus Glatthaar, PV2+, Bifacial TBC polyZEBRA Solar Cell meets PV2+’s copper plating metallization |
| Session VI: Transition towards Cu paste metallization |
| Sebastian Pingel, Fraunhofer ISE, Efficient Silver Usage in Screen-Printed SHJ Cells for the Terawatt Production Era |
| Thad Druffel, Bert Thin Films, LECO Processing of Copper Pastes |
| Oumaima Mhirsi, Fraunhofer ISE, Unveiling Mechanistic Differences in the Curing of Copper and Silver Pastes for Heterojunction Solar Cells |
| Session VIII: Progress and understanding of screen printed contacts |
| Andreas Lorenz, Fraunhofer ISE, Advancements in Fine Line Metallization: Latest Achievements at Fraunhofer ISE |
| Yuelin Xiong, University of Oxford, A Failure Mode Affecting the Reliability of LECO Metallised High-Efficiency TOPCon Solar Cells |
| Aathira Nair, Fraunhofer ISE, Progress on reducing contact width in solar cell metallization by optimized laser processing during screen production |
| Session IX: Metallization and Interconnection for Si-perovskite tandem solar cells |
| Valérie Depauw, imec, Multwire Interconnection with SnBi Alloy for Perovskite/Silicon Tandems |
| Benedikt Fischer, Forschungszentrum Jülich, Room-Temperature Interconnection of Thermally Sensitive Solar Cells Using Electrically Conductive Tape |
| Tillman Finger, Karlsruhe Institute for Technology, T-ECA – Thermoplastic Adhesives for Solar Cell Interconnection |
| Freya Leyland, HZB, Investigating barrier properties of TCOs against metallization and interconnection materials for thermal stability of perovskite-based solar cells |
| Poster Session A (Session II) |
| A-01, Marianne Kronsbein, Karlsruhe Institute of Technology, Electrically Conductive Adhesives based on Silver-Coated Glass and Copper Particles |
| A-02, Yuelin Xiong, University of Oxford, Copper Diffusion at the Copper/Silicon Interfaces: Is it really that big a problem? |
| A-03, Veysel Unsur, ODTU-GUNAM, Beyond Silver: Comparative Performance Analysis of Alternative Metallization Strategies in Silicon Solar Cells |
| A-04, Donald Intal, University of North Carolina at Charlotte, The Impact of LECO on Screen Printed Copper Contact with PERC Architecture |
| A-05, Cesar Manna, PVNanocell, Advancing Screen Printed Ag and Cu Nanoparticle Materials for Low Temperature Application: Rheology-Controlled Linewidth, Perovskite Adhesion, and Low-Temperature Stability |
| A-06, Yuelin Xiong, University of Oxford, The Bulk and Interface Properties of Cu Screen-printed Contacts on Silicon Solar Cells |
| A-07, Yu Wu, TNO, Investigation of Cu metallization and interconnection in the HJT solar cell & module manufacturing |
| A-08, Roberto Boccardi, DTU Electro – SPVS group, Wet etch opening of bifacial i-TOPCon cells for Ni/Cu plated contacts |
| A-09, Melisa Korkmaz Arslan, ODTÜ-GÜNAM, INNOVATIVE CU PLATING STRATEGY FOR INDUSTRY COMPATIBLE METALLIZATION OF SHJ SOLAR CELL |
| A-10, Melika Motaghian, TU Eindhoven, Engineering the optoelectronic properties of ZnSnOx buffer layers by controlling the composition of the deposited films in high-throughput spatial ALD |
| A-11, Jan Kegel, Solyco TECC GmbH, TECC-Connect: A Universal Interconnction Technology for Diverse Solar Cell Metallisations |
| A-12, Marcus Klein, SURAGUS GmbH, Near-process sensor integration of characterization of inv-vacuo deposited thin films by eddy current sensor metrology |
| Poster Session B (Session VII) |
| B-01, Stephan Großer, Fraunhofer CSP, Microscopic Investigation on Quantification of Percolating and Non-Percolating Fillers in Electrically Conductive Adhesives |
| B-02, Yanxin Liu, Forschungszentrum Jülich GmbH, Room-Temperature Interconnection of Thermally Sensitive Solar Cells Using Electrically Conductive Tape |
| B-03, Jannik Niels Kleesiek, Helmholtz-Zentrum Berlin, Influence of ITO sputter conditions on the Ag-TCO front contact for perovskite-silicon tandem solar cells |
| B-04, Leonhard Böck, Fraunhofer-Institut für Solare Energiesysteme, How to Interconnect III-V/Si Tandem Solar Cells for Maximum Module Efficiency |
| B-05, Max Ailinger, Karlsruher Institut für Technologie (KIT), Correlation between Flow Properties and Print Quality in the Front-Side Metallization of Solar Cells |
| B-07, Mihir Mahajan, imec, Exploring Carbon-Based Paste Properties for Metallization of Low-Temperature Solar Cells |
| B-08, Mohamed Issifi Yacouba, Jülich research center, High efficiency silicon heterojunction solar cells with silver-free metallization; comparing Ag, AgCu and Cu metallization |
| B-09, Jonas Valentijn, University of Twente, Advancements in String Printing: Understanding and Improving String Coating. |
| B-10, Vicky Cooperstein, Copprint, Conductive Copper Pastes for PV: New inks with high thixotropy and conductivity achieve top performance |
| B-11, Marcial Fernandez-Castro, Tecnalia Research & Innovation, Investigating performance variations and electrical resistance of Electrically Conductive Adhesives (ECAs) for Solar Cells |
| B-12, Quiterie Emery, Helmholtz-Zentrum Berlin für Materialen und Energie,, Quiterie Emery |
