PRESENTATIONS MIW 2023 MIW2023 organizers, OpeningChristophe Ballif, CSEM/EPFL, Introductory talkSession I: Screen-printed metallisation : state-of-the-art and beyondPadhamnath Pradeep , SERIS, Screen-Printed metallization for industrial solar cells – current perspectives and future opportunitiesGlatthar Raphael, Univ. Konstanz, Fundamental microscopic studies on the etching behavior of silver pastes on poly-Si/SiOx passivating contactsTokiko Misaki, Asada Mesh, Deformation Behavior of Screen Mesh in Screen Printing and Its Effect on Printing ResultsSession II: Multi-busbars/wire solderingDominik Rudolph, ISC Konstanz, Improvement of solder interconnections applied on back contact solar cells with low-temperature copper paste busbarsJonas Marten, KIT, Highly conductive coated wire for interconnetion of solar cells with TECC-Wire technologyRik van Dyck, imomec, Investigation of Multi-Wire Interconnected Lightweight PV modules Using Micro-Computed TomographyPoster sessionFlorent Pernoud, CEA, Recent developments of HJT screen printing process at CEA-INESJanis Andersons, Univ. Tweente, High Aspect Ratio Triangular Front Contacts for Solar Cells Fabricated by String-printingAlejandro Borja Block, CSEM/EPFL, Challenges of black metallic interconnects for integrated PV module applicationDaniel Ourinson, FhISE, Paste-based Silver Reduction for iTOPCon Solar CellsIñaki Cornago, CENER, TiSi2 and LIFT as potential alternatives to silver and screen printing for solar cells electric contactsSession III: Ag reduction in low temperature pastesAlexis Barrou, CSEM, Life Cycle Assessment of Minerals and Metals for PV: Case Study with the Silicon Heterojunction TechnologySebastian Pingel, FhISE, Progress on the reduction of silver consumption in metallization of SHJ solar cellsMariana Bertoni, Arizona State University, Performance and Accelerated Testing of Reactive Silver Inks Metallization of Silicon Heterojunctions with 90% less SilverMaximilian Pospischil, HighLine Technology, Optimizing solar cell metallisation by parallel dispensingSession IV: Copper-based cell metallisationVeysel Unsur, Necmettin Erbakan University, ODTU-GUNAM, Screen Printable Fire Through Nickel Contacts for Crystalline Silicon Solar CellsThad Druffel, Bert Thin Films/Univ. Notrth Carolina, Screen Printable Copper Pastes for Silicon Solar CellsAgata Lachowicz, CSEM, Stability of Mini-modules with Copper Plated Heterojunction Solar CellsSession V: Silicon heterojunction cell metallisation and LT interconnectionsLinjia Zhang, Suzhou iSilver Materials Co., Research and development of low temperature paste for silicon heterojunction solar cellsAngela De Rose, FhISE, Low-temperature metallization & interconnection for silicon heterojunction and perovskite silicon tandem solar cellsGermain Rey, CEA, Silicon heterojunction solar cells: solder, process and equipment qualificationRémi Monna, CEA, Reduction of silver usage in ECA based busbar interconnectionSession VI: ECA based interconnections technologiesVincent Barth, CEA, Methodology of ECA material characterization and qualificationMaría Ignacia Devoto Acevedo, ISC Konstanz, Validation of methodology to determine the contact resistivity of ECA-based bonds grounded on end-contact resistance measurements using redundant and modified TLM test structuresJulian Weber, FhISE, Electrically conductive adhesive-free interconnection of shingle solar cellsVeronika Nikitina, FhISE, Shingling meets perovskite-silicon heterojunction tandem solar cells
